According to a CNBC op-ed, China effectively countered Trump’s renewed 2025 trade war with strategic export controls and trade diversions. While the country’s trade surplus soared past $1 trillion, domestic demand remained weak, revealing a split economic reality.
The diplomatic row over a Chinese-owned chipmaker is getting uglier. China is now publicly accusing the Dutch government of making “mistakes” and threatening the stability of the entire semiconductor supply chain.
Copper is having its biggest annual price jump in over 15 years. The rally, fueled by AI infrastructure needs and supply concerns, shows no sign of slowing down.
A new European project is tackling the high cost and environmental impact of advanced semiconductors. By reusing rare materials, it hopes to make sub-THz technology viable for mass markets.
The long-awaited Lisuan G100 GPUs have started shipping to Chinese customers. Initial shipments are for professional “digital twin” use, but the 7G106 model is a gaming-focused card that could hit retail by early 2026.
Filtrabit, a Finnish cleantech company, has secured a €2 million funding commitment for its next round. The company plans to use the capital to expand its industrial dust control systems into new international markets.
Japan is launching a world-first test to mine rare-earth mud from the deep seabed. The project is a direct move to secure supplies away from China’s dominance.
Nvidia has stopped a test using Intel’s advanced chip packaging technology. In a separate blow to Silicon Valley, a federal judge ruled a new $100,000 fee on H-1B visa applications can proceed.
A new 15-year semiconductor technology roadmap predicts we’ll see 0.2nm chips and monolithic 3D structuring by 2040. The forecast also includes radical improvements for memory and AI processor performance.
Intel has revealed a conceptual but highly ambitious chip packaging design. It showcases a future platform that could integrate up to 16 compute tiles and 24 HBM memory stacks, leveraging its next-gen 18A and 14A process nodes alongside advanced Foveros 3D and EMIB-T technologies. This is a clear sh
