A new report flips the script on US manufacturing. The sector is hiring aggressively, but a stubborn perception problem is leaving hundreds of thousands of jobs open. The real story is a struggle to attract talent, not an industry in retreat.
According to a new report, Apple is working on a revamped iMac Pro that could launch in 2026. This all-in-one desktop would reportedly pack high-end M5 Max silicon into a large-screen design, filling a gap in the pro desktop lineup.
Inbolt has launched a new AI-powered bin picking system that mounts a 3D camera directly on the robot arm. The tech enables human-like adaptability, handling randomly placed or hidden parts with high speed and accuracy.
The pioneering robotics company iRobot has filed for Chapter 11 bankruptcy protection. This follows years of financial decline and the collapse of a $1.4 billion acquisition by Amazon.
Newly leaked Apple code suggests the company is developing a high-end iMac model with an M5 Max chip. This could signal the return of an iMac Pro with a larger display aimed at professional users.
The semiconductor industry is caught between government incentives and the threat of tariffs, according to a new survey. While building U.S. fabs is a priority, leaders worry about energy and supply chains. Yet, surging AI demand is boosting revenue and optimism to a 20-year high.
Volkswagen is ending car production at its Dresden plant to create a research hub for AI and robotics. This shift comes as the AI infrastructure spending spree, fueled by massive corporate debt, faces a sharp market correction.
A French startup is accelerating the shift to autonomous farming. Agreenculture has secured €6 million in Series A funding to industrialize its plug-and-play autonomy kits for agricultural machinery manufacturers.
Chinese foundry SMIC has achieved volume production of its 5nm-class “N+3” node without using EUV lithography. TechInsights confirmed the node is used for Huawei’s new Kirin 9030 SoC. However, the process faces significant yield challenges due to complex multi-patterning.
The massive power demands of AI chips are forcing a fundamental shift in how they’re built. Co-packaged optics (CPO) is emerging as the critical solution, and a trio of Taiwanese tech leaders are positioning themselves to own the ecosystem.
