ManufacturingSemiconductors

Nvidia’s US Chip Manufacturing Faces Advanced Packaging Bottleneck Despite Arizona Production Start

Nvidia celebrates first Blackwell wafers from TSMC’s Arizona facility while facing continued reliance on Taiwanese packaging plants for top-tier GPUs. The advanced CoWoS packaging technology required for high-performance chips remains concentrated in Taiwan until US alternatives emerge in coming years.

US Manufacturing Milestone Meets Packaging Reality

Nvidia has reportedly begun producing chips at TSMC‘s Arizona facility, with CEO Jensen Huang celebrating the first Blackwell wafer from the Fab21 plant. However, sources indicate that turning these silicon wafers into complete, high-performance products may still require shipping them to Taiwan for advanced packaging processes that remain concentrated in the island nation.

BusinessTechnology

Nvidia Chief Jensen Huang to Engage Global Leaders at APEC Summit in Seoul

Nvidia CEO Jensen Huang is set to participate in the Asia-Pacific Economic Cooperation CEO Summit in South Korea, where he will meet with top executives from Samsung and SK Hynix. The event highlights Nvidia’s focus on AI, robotics, and autonomous vehicles amid ongoing global trade tensions.

Nvidia CEO to Attend High-Profile APEC Summit in South Korea

Nvidia CEO Jensen Huang will attend the Asia-Pacific Economic Cooperation CEO Summit in South Korea later this month, according to reports from Reuters. The summit, scheduled from October 28 to 31, runs parallel to the annual APEC leaders’ forum, which brings together heads of 21 member countries. Sources indicate that Huang plans to engage with global leaders and top Korean executives to discuss advancements in technology and economic growth.