Nvidia’s US Chip Manufacturing Faces Advanced Packaging Bottleneck Despite Arizona Production Start
Nvidia celebrates first Blackwell wafers from TSMC’s Arizona facility while facing continued reliance on Taiwanese packaging plants for top-tier GPUs. The advanced CoWoS packaging technology required for high-performance chips remains concentrated in Taiwan until US alternatives emerge in coming years.
US Manufacturing Milestone Meets Packaging Reality
Nvidia has reportedly begun producing chips at TSMC‘s Arizona facility, with CEO Jensen Huang celebrating the first Blackwell wafer from the Fab21 plant. However, sources indicate that turning these silicon wafers into complete, high-performance products may still require shipping them to Taiwan for advanced packaging processes that remain concentrated in the island nation.