Tag: TSMC

ManufacturingSemiconductorsTechnology

Samsung VP: Chip Shrinks Deliver Diminishing Returns, DTCO Gains Importance

Samsung Electronics Foundry Vice President Shin Jong-shin reportedly stated that traditional process miniaturization now yields only 10-15% improvements. The company is increasingly focusing on Design-Technology Co-Optimization, which could account for 50% of performance gains at 3nm and below. This strategic shift comes as Samsung develops its second-generation 2nm GAA process.

Samsung Electronics is signaling a fundamental shift in semiconductor strategy as the traditional approach of shrinking transistors delivers diminishing returns, according to recent industry reports. The company’s Foundry Vice President Shin Jong-shin reportedly revealed that process miniaturization alone now offers only 10-15% improvements in performance and area reduction.

The DTCO Revolution

by Elijah Porter
ManufacturingSemiconductorsTechnology

Industry Sources Cast Doubt on Qualcomm and MediaTek Transition to Samsung’s 2nm Chip Production

New reports suggest Qualcomm and MediaTek are unlikely to shift 2nm chip production to Samsung Foundry despite earlier speculation. Industry sources indicate timing constraints and acceptable TSMC pricing make such a transition improbable. The semiconductor giants appear committed to maintaining technological parity with Apple through existing partnerships.

Timing Constraints Challenge Foundry Transition

Recent speculation about Qualcomm and MediaTek switching to Samsung Foundry for their 2nm chip orders appears increasingly unlikely, according to supply chain sources familiar with the matter. The reports, which initially suggested both semiconductor designers were exploring alternatives to TSMC due to rising costs, now face significant timing challenges that make such a transition impractical for upcoming product cycles.

by Aaron Vale
ManufacturingSemiconductors

Nvidia’s US Chip Manufacturing Faces Advanced Packaging Bottleneck Despite Arizona Production Start

Nvidia celebrates first Blackwell wafers from TSMC’s Arizona facility while facing continued reliance on Taiwanese packaging plants for top-tier GPUs. The advanced CoWoS packaging technology required for high-performance chips remains concentrated in Taiwan until US alternatives emerge in coming years.

US Manufacturing Milestone Meets Packaging Reality

Nvidia has reportedly begun producing chips at TSMC‘s Arizona facility, with CEO Jensen Huang celebrating the first Blackwell wafer from the Fab21 plant. However, sources indicate that turning these silicon wafers into complete, high-performance products may still require shipping them to Taiwan for advanced packaging processes that remain concentrated in the island nation.

by Elijah Porter
EconomyMarkets

Asia-Pacific Markets Face Pressure Amid Banking Sector Concerns and Trade Tensions

Asia-Pacific markets were poised for a weaker open Friday following Wall Street’s banking sector concerns. Regional banks and investment firms faced pressure as bad loan worries resurfaced. Taiwan Semiconductor Manufacturing Co.’s quarterly results added to the regional focus.

Market Weakness Spreads to Asia-Pacific Region

Asia-Pacific markets were reportedly set for a weaker opening Friday, according to market analysis, tracking significant losses on Wall Street as concerns over the banking sector and ongoing trade tensions intensified. The negative sentiment appeared to be spreading globally, with sources indicating that fears around problematic loans in the U.S. banking system were driving the market movement.

by Aaron Vale