A new 15-year semiconductor technology roadmap predicts we’ll see 0.2nm chips and monolithic 3D structuring by 2040. The forecast also includes radical improvements for memory and AI processor performance.
Intel has revealed a conceptual but highly ambitious chip packaging design. It showcases a future platform that could integrate up to 16 compute tiles and 24 HBM memory stacks, leveraging its next-gen 18A and 14A process nodes alongside advanced Foveros 3D and EMIB-T technologies. This is a clear sh
Kanto-PPC’s U.S. arm is building a major chemical manufacturing campus in Casa Grande, Arizona. The facility is a direct play to supply the massive new fabs being built by TSMC, Intel, and Micron with high-purity materials.
South Korean prosecutors have charged former Samsung employees with leaking billion-dollar 10nm DRAM technology to China’s CXMT. The leaks, involving hundreds of process steps, helped China produce its first mass-market DRAM in 2023. The estimated damage runs into trillions of won.
Intel’s next-next-gen Xe4 “Druid” graphics architecture has been spotted in a data center shipping manifest. This is surprising, as it’s been absent from roadmaps and was only expected inside future CPUs. The find suggests Intel is cooking up more GPU projects than it’s publicly admitting.
2025 saw Nvidia’s CEO, Jensen Huang, leverage the company’s AI chip dominance into direct geopolitical influence, advising President Trump on export policy. The company also committed a staggering $100 billion to OpenAI and other firms, fueling debates about an AI investment bubble. We break down th
Chip startup Mythic Inc. has secured $125 million in new funding to take on Nvidia in the AI processor market. The round was led by DCVC and included SoftBank, Honda, and Lockheed Martin.
The semiconductor industry is caught between government incentives and the threat of tariffs, according to a new survey. While building U.S. fabs is a priority, leaders worry about energy and supply chains. Yet, surging AI demand is boosting revenue and optimism to a 20-year high.
Broadcom’s stock suffered its worst day since January, plummeting 10.5% to around $363.70. This came after CEO Hock Tan outlined a $73 billion AI product backlog, a figure that immediately drew skepticism from top analysts during the earnings call.
Chinese foundry SMIC has achieved volume production of its 5nm-class “N+3” node without using EUV lithography. TechInsights confirmed the node is used for Huawei’s new Kirin 9030 SoC. However, the process faces significant yield challenges due to complex multi-patterning.
