A new European project is tackling the high cost and environmental impact of advanced semiconductors. By reusing rare materials, it hopes to make sub-THz technology viable for mass markets.
The long-awaited Lisuan G100 GPUs have started shipping to Chinese customers. Initial shipments are for professional “digital twin” use, but the 7G106 model is a gaming-focused card that could hit retail by early 2026.
Filtrabit, a Finnish cleantech company, has secured a €2 million funding commitment for its next round. The company plans to use the capital to expand its industrial dust control systems into new international markets.
Japan is launching a world-first test to mine rare-earth mud from the deep seabed. The project is a direct move to secure supplies away from China’s dominance.
Nvidia has stopped a test using Intel’s advanced chip packaging technology. In a separate blow to Silicon Valley, a federal judge ruled a new $100,000 fee on H-1B visa applications can proceed.
A new 15-year semiconductor technology roadmap predicts we’ll see 0.2nm chips and monolithic 3D structuring by 2040. The forecast also includes radical improvements for memory and AI processor performance.
Intel has revealed a conceptual but highly ambitious chip packaging design. It showcases a future platform that could integrate up to 16 compute tiles and 24 HBM memory stacks, leveraging its next-gen 18A and 14A process nodes alongside advanced Foveros 3D and EMIB-T technologies. This is a clear sh
Kanto-PPC’s U.S. arm is building a major chemical manufacturing campus in Casa Grande, Arizona. The facility is a direct play to supply the massive new fabs being built by TSMC, Intel, and Micron with high-purity materials.
The US has officially banned the sale of new foreign-made drones and their components, citing national security. The move directly targets market leader DJI, though existing drones and already-approved models are still okay. This reshapes the entire competitive landscape overnight.
South Korean prosecutors have charged former Samsung employees with leaking billion-dollar 10nm DRAM technology to China’s CXMT. The leaks, involving hundreds of process steps, helped China produce its first mass-market DRAM in 2023. The estimated damage runs into trillions of won.
